Problem Types, Defects, & Feeatures



 

Found by Engineers during Production, Testing, QC, or QA

Click Feature to view Images of Problems

  Adhesive Failure Beading Blisters Bond Pad Failure Bubbles  
  Bumps Contamination Cracking Coating Failure Corrosion  
  Counterfeit Crystallites Damage Defect Delamination  
  Dendrites Diffusion Discoloration Electrical Failure Evaporation residue  
  Extractables Failure Feature Film Thickness Forensics  
  Heat effects Mechanical Failure Metal Stack Optical Performance Outgassing  
  Oxidation Peeling Pit Pores Radiation Effects  
  Reverse Engineer Silicone oil Stain Storage effects Strain  
  Stress Vacuum effects Trace Element Vendor Changed Water Residue  
  Wrong chemistry       .  

 

 



 

Industries and Their Common Problems

 

XPS Metrology supports key industries and tech areas. We offer a wide range of analytical solutions for numerous problems, with our focus being the application of XPS..

If you don’t see your problem type, defect, or feature listed here, please call or email.
We look forward to supporting your efforts to solve problems and answer your needs. 

Adhesives
  • Bulk, large, and small-scale mechanical behavior
  • Delaminations
  • Peeling
  • Property degradation
  • Silicone contamination
Automotives
  • Battery material degradation
  • Catalyst performance
  • Corrosion
  • MEM failures
  • Sensor failures
Batteries
  • Analysis of outgassing product
  • Electrolyte diffusion
  • Non-destructive X-ray evaluation
  • Product identification
  • Raw materia impurity analysis
Chemicals 
  • Chemical composition
  • Contaminant analysis
  • Crystallinity
  • Detection of impurities 
  • Particle size and morphology
  • Porosity and surface area
Displays
  • Display / color filter / TFT glass fracture
  • Layer delamination
  • OLED/LCD failures
  • Optically-clear adhesive issues
  • Trace corrosion identification
Electronics
  • Corrosion and degradation
  • Dendrite growth
  • De-adhesion
  • Electromigration
  • Fracture and fatigue
  • Radiation embrittlement
  • Stress-driven diffusion
Medical Devices
  • Corrosion analysis
  • Electrical failures
  • Quality control to meet rigorous industry standards
  • Mechanical failures
  • Small-scale property testing
Microchips
  • Cracking
  • Contamination analysis
  • ESD failures
  • Plating issues
  • Solder joint failures
  • Wire bond failures
Renewables
  • Brittle fractography
  • Composite delamination
  • Encapsulation issues
  • Electrical failures
  • Mechanical damage
  • Moisture degradation

 

 

 



 

Materials & Parts Commonly Analyzed by XPS

 

    Anodes Bond pads Bones Battery parts Bio-materials  
    Catalysts Cathodes Coal Coatings Cosmetics  
    Dental materials Diamonds Drugs Explosives Fiberglass  
    Fiber optics Filaments Food Fuel cells Fuel remnants  
    Gems Glasses Glues Hair Ink  
    Inorganics Jewelrey Laser parts Liquid remnants Lubricants  
    Plastic Bags & Boxes   Medical implants Metal alloys Minerals Moulds  
    Paints Papers Polymers Rare Earth Materials Rocks  
    Semiconductors Solar panels Stints Teeth Thin layered films    
    Turbines Viscous oils Waxes      

 

 



 


Images of Problems Analyzed by XPS
Found by Engineers during Production, Testing, QC, or QA

  Adhesive Failure  
  Beading  
  Blisters  
  Bond Pad Failure  
  Bubbles  
  Bumps  
  Contamination  
  Cracking  
  Coating Failure  
  Corrosion  
  Counterfeit  
  Crystallites  
  Damage  
  Defect  
  Degradation  
  Delamination  
  Dendrites  
  Diffusion  
  Discoloration  
  Electrical Failure  
  Evaporation residue  

 

 

  Extractables  
  Failure  
  Feature  
  Film Thickness  
  Forensics  
  Heat Damage  
  Mechanical Failure  
  Metal Stack  
  Optical Coating  
  Outgassing  

 

  Oxidation
  Peeling  
  Pit  
  Pores  
  Radiation Effects  
  Reverse Engineer  
  Silicone oil  

 

  Stain  
  Storage effects  
  Strain  
  Trace Element  
  Vacuum effects  
  Vendor Changed  
  Water Residue  
  Wrong chemistry